SnPb 锡铅

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1.

Effect of Enhanced Particles Cu on Creep Rupture Life of SnPb Based Composite Solder

铜颗粒增强对锡铅钎料蠕变寿命的影响

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2.

Preparation of SnPb solder bump by electroplating process

电镀方法制备锡铅焊料凸点

3.

The Effect of Lead Frame Material on Interface Microstructure between Copper Alloy and SnPb Solder

引线框架材料对铜合金与锡铅焊料界面组织的影响

4.

Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder

银镍金属微细颗粒对锡铅基复合钎料力学性能的影响

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